>> CAPABILITY

 

製程別 項目 製程能力規格
底片Film 1.繪制底片尺寸.   Drawing film size 30X26"
2.繪制最小線寬/線距   Draw the minimum line width / space 2/2mil
3.黑白,棕色 底片最大尺寸.   Black and white, brown film the maximum size 黑片Black film30x26"
4.電腦輔助製造資料輸入格式.    Computer-aided manufacturing data input format 274X    274D
5.電腦輔助製造資料輸出格式.Computer-aided manufacturing data output format 274X    274D
內層 乾膜
Dry Film(Inner Layer)
1.最小線寬/線距Minimum line width / spacing 3mil
2.最小焊盤尺寸.Minimum pad size 孔徑Aperture+8 mil (0.2 mm)
3.導通孔錫環.Tin ring vias 3mil
4.非導通孔隔離Non-isolated vias 6mil
5.板厚最小到最大The smallest to the largest thickness 0.3~3.0mm
6.板面尺寸最小到最大.The smallest to the largest board size 310mm460mm
7.銅厚Copper thickness Hoz~3oz
8.蝕刻因子(0.5/1/2盎司oz)Etch  Factor 0.5盎司oz~6盎司oz
9.微蝕(銅厚損失)Micro-erosion(Copper thickness loss) 50u"
10.最小板邊Minimum Edge 0.1mm
外層 乾膜
Dry Film(Outer Layer)
1.最小線寬/線距Minimum line width / spacing 3/3mil
2.最小焊盤尺寸Minimum pad size BGA  8mil
3.板厚最小到最大The smallest to the largest thickness 0.4~6.0mm
4.板面尺寸最小到最大The smallest to the largest board size 0.3~3.5mm
5.導通孔錫環Tin ring vias 4mil(tenting)
6.蝕刻因子Etch Factor 0.3(YX)
鑽孔
Drill
1.最小及最大鑽頭Minimum and maximum bit 0.15~6.4mm
2.最大板面尺寸Maximum board size 660~625mm
3.孔位公差Hole tolerance +/-2mil
4.成品板孔徑公差Finished plate diameter tolerance +/-0.075mm
5.分段鑽Segmented diamond yes(3Segment)
6.孔壁粗糙度Hole wall roughness 0.6mil
壓合
Lamination
1.最小及最大板厚Minimum and maximum thickness 0.2~6.0mm
2.最小工作板面尺寸Minimum  board size of work 200x150mm
3.最大工作板面尺寸Maximum  board size 700x640mm
4.內層板與銅箔之間最多膠片數量Between the inner plate and the copper film up to the number of prepreg 3
5.壓合後膠片厚度After the film thickness of the lamination:+/-0.5mil/ +/-1mil
6.對位公差Of tolerance:+/-2mil Can
鍍銅
Copper
1.最小到最大板厚Minimum to the maximum thickness 0.4~6.0mm
2.縱橫比Aspect Ratio(孔徑及板厚比Diameter and thickness than) 1:12
3.一般1.6mm板厚的孔銅厚度General thickness of 1.6mm hole copper thickness 0.6mm
4.孔銅Hole copper: 1.4mil
5.面銅Copper surface 2mil
5.鍍銅公差Copper tolerance(公差Tolerance+/-mil) +/-0.3mil
6.電流計算Current Calculation Length xWidth/929x1xASF(密度電流 Current density)
防焊
Solder Mask
1.最小到最大板厚Minimum to the maximum thickness 0.4~0.6mm
2.板面尺寸Board Size 700x640mm
3.基材上防焊厚度最小到最大Substrate thickness on the solder minimum to maximum 0.4~2mil
4.銅面上防焊厚度最小到最大Solder thickness of the copper surface of the smallest to the maximum 0.4~2mil
5.防焊錫墊尺寸比線路錫墊尺寸最少Anti-tin solder pad size pad size than the line at 3mil
6.在錫墊間防焊最小寬度Tin  solder between the minimum width of pad 3mil
7.QFP間防焊最小寬度.QFP  solder in between the minimum width 3mil
8.塞孔尺寸.Plug hole size 0.5mm
9.前處理Pre-treatment 水洗刷磨、烘烤Wash water mill, baking
文字
Silk Screen
1.最小文字尺寸(最小文字符號)Minimum text size (smallest text symbol) 5mil(線寬Line Width)28mm(High )
2.文字與錫墊的間距The distance between text and tin pad 5mil
碳墨
Carbon ink
1.最小到最大板厚Minimum to the maximum thickness No
2.板面尺寸Board Size 400x500mm
3.碳墨厚度The thickness of the carbon ink 0.8~2 mils在銅面上(On copper surface)
5.碳墨錫墊(應比電路錫墊大)Tin-carbon ink pad (pad should be larger than the circuit tin) 8mil
6.碳墨錫墊間距Tin-carbon  ink pad pitch 31mil
7.可印碳墨間距Spacing can be printed carbon ink 15mil
噴錫
HAL
1.最小到最大板厚Minimum to the maximum thickness 0.6~5.0mm
2.板面尺寸最小到最大The smallest to the largest board size 160~595mm
3.最小孔徑(無錫塞)The smallest aperture (Wuxi plug) 0.45mm
4.錫厚最小到最大The smallest to the largest tin thickness 30~1000
金手指
Goldfinger
1.最小到最大板厚Minimum to the maximum thickness 0.5~4.0mm
2.板面尺寸最小到最大(工作板面尺寸極限)
The smallest to the largest board (board size limits work)
150~610mm
3.鎳厚度最小到最大Minimum  to the maximum thickness of nickel 80~200mm
4.金厚度最小到最大Gold thickness of the smallest to the largest 3u"~60u"
成型
Routing
1.最小到最大板厚Minimum to the maximum thickness 0.2~6.0
2.成品板尺寸Finished board size 5x5mm
3.外型尺寸公差Dimension Tolerance +/-0.1mm
4.成型最好公差Best Tolerance Molding 0.15mm
5.金手指間U槽公差Tolerance  between the U-slot cheat +/-0.05mm
V形切割
V Score
1.最小到最大板厚Minimum to the maximum thickness 0.3~5.0mm
2.板面尺寸長XBoard Size Length X Width 最小Least 90x55mm   最大Maximum(Wide)550mmx(High)不限Limited
3.位置準確性及殘留公差Location accuracy and the residual tolerance +/-0.05mm
4.V形切割角度V-cut angle 30 Degree       45Degree
5.V形切割跳刀V-shaped cutting knife dance 最小間距Minimum spacing3mm    (30 Degree)
金手指斜邊
Hypotenuse cheat
1.金手指斜邊角度Finger hypotenuse angle 20/30/45
2.最小到最大板厚Minimum to the maximum thickness 0.8mm
3.最小到最大成品尺寸Finished  size of the smallest to the largest 0.25~1.81mm
抗氧化
ENTEK
1.最小到最大板厚Minimum to the maximum thickness 0.1~5.0mm
2.最小到最大單片尺寸Size  of the smallest to the largest single 80~640mm
3.覆蓋厚度Cover thickness 0.2~0.4mm
目視檢查
Visual inspection
1.彎翹Bending upwards 仟分之7    7 parts per thousand
2.離子污染Ion contamination 區域塊分隔Regional blocks are separated
3.烘板Baking sheet 15分鐘   140    140 degrees 15 minutes
測試
Test
1.輸入格式Input format IPC356
2.測試章Chapter Test YES
3.斷短路測試點間距Short-circuit  breaking test point spacing 4/4mil
4.斷短路測試板子尺寸Short-circuit  breaking test board size 610X620mm
5.斷短路測試點數量.Short-circuit  breaking number of test points 無限制Unlimited
6.斷短路測試條件(電壓/開路阻抗)Short-circuit breaking test conditions (voltage / open
circuit impedance)
DC 5/10 V  10Ω~20Ω±2Ω
7.阻抗 Impedance 絕緣阻抗Insulation Resistance ±10%
表面處理
Surface treatment
噴錫HAL
抗氧化ENTEK
全板金Gold plating
化鎳金Electroless Nickel / Immersion Gold
化銀Immersion silver
30/1500 u"
0.15/0.35um
10-20u"
100-200u"Ni   1-2" Au
6/15u"