>> CAPABILITY
| 製程別 | 項目 | 製程能力規格 |
| 底片Film | 1.繪制底片尺寸. Drawing film size | 30X26" |
| 2.繪制最小線寬/線距 Draw the minimum line width / space | 2/2mil | |
| 3.黑白,棕色 底片最大尺寸. Black and white, brown film the maximum size | 黑片Black film30x26" | |
| 4.電腦輔助製造資料輸入格式. Computer-aided manufacturing data input format | 274X 274D | |
| 5.電腦輔助製造資料輸出格式.Computer-aided manufacturing data output format | 274X 274D | |
| 內層 乾膜 Dry Film(Inner Layer) |
1.最小線寬/線距Minimum line width / spacing | 3mil |
| 2.最小焊盤尺寸.Minimum pad size | 孔徑Aperture+8 mil (0.2 mm) | |
| 3.導通孔錫環.Tin ring vias | 3mil | |
| 4.非導通孔隔離Non-isolated vias | 6mil | |
| 5.板厚最小到最大The smallest to the largest thickness | 0.3~3.0mm | |
| 6.板面尺寸最小到最大.The smallest to the largest board size | 310mm✽460mm | |
| 7.銅厚Copper thickness | Hoz~3oz | |
| 8.蝕刻因子(0.5/1/2盎司oz)Etch Factor | 0.5盎司oz~6盎司oz | |
| 9.微蝕(銅厚損失)Micro-erosion(Copper thickness loss) | 50u" | |
| 10.最小板邊Minimum Edge | 0.1mm | |
| 外層 乾膜 Dry Film(Outer Layer) |
1.最小線寬/線距Minimum line width / spacing | 3/3mil |
| 2.最小焊盤尺寸Minimum pad size | BGA 8mil | |
| 3.板厚最小到最大The smallest to the largest thickness | 0.4~6.0mm | |
| 4.板面尺寸最小到最大The smallest to the largest board size | 0.3~3.5mm | |
| 5.導通孔錫環Tin ring vias | 4mil(tenting) | |
| 6.蝕刻因子Etch Factor | 0.3(YX) | |
| 鑽孔 Drill |
1.最小及最大鑽頭Minimum and maximum bit | 0.15~6.4mm |
| 2.最大板面尺寸Maximum board size | 660~625mm | |
| 3.孔位公差Hole tolerance | +/-2mil | |
| 4.成品板孔徑公差Finished plate diameter tolerance | +/-0.075mm | |
| 5.分段鑽Segmented diamond | yes(3段Segment) | |
| 6.孔壁粗糙度Hole wall roughness | 0.6mil | |
| 壓合 Lamination |
1.最小及最大板厚Minimum and maximum thickness | 0.2~6.0mm |
| 2.最小工作板面尺寸Minimum board size of work | 200x150mm | |
| 3.最大工作板面尺寸Maximum board size | 700x640mm | |
| 4.內層板與銅箔之間最多膠片數量Between the inner plate and the copper film up to the number of prepreg | 3張 | |
| 5.壓合後膠片厚度After the film thickness of the lamination:+/-0.5mil/張 | +/-1mil | |
| 6.對位公差Of tolerance:+/-2mil | 可Can | |
| 鍍銅 Copper |
1.最小到最大板厚Minimum to the maximum thickness | 0.4~6.0mm |
| 2.縱橫比Aspect Ratio(孔徑及板厚比Diameter and thickness than) | 1:12 | |
| 3.一般1.6mm板厚的孔銅厚度General thickness of 1.6mm hole copper thickness | 0.6mm | |
| 4.孔銅Hole copper: | 1.4mil | |
| 5.面銅Copper surface | 2mil | |
| 5.鍍銅公差Copper tolerance(公差Tolerance+/-mil) | +/-0.3mil | |
| 6.電流計算Current Calculation | 長Length x寬Width/929x1xASF(密度電流 Current density) | |
| 防焊 Solder Mask |
1.最小到最大板厚Minimum to the maximum thickness | 0.4~0.6mm |
| 2.板面尺寸Board Size | 700x640mm | |
| 3.基材上防焊厚度最小到最大Substrate thickness on the solder minimum to maximum | 0.4~2mil | |
| 4.銅面上防焊厚度最小到最大Solder thickness of the copper surface of the smallest to the maximum | 0.4~2mil | |
| 5.防焊錫墊尺寸比線路錫墊尺寸最少Anti-tin solder pad size pad size than the line at | 3mil | |
| 6.在錫墊間防焊最小寬度Tin solder between the minimum width of pad | 3mil | |
| 7.在QFP間防焊最小寬度.QFP solder in between the minimum width | 3mil | |
| 8.塞孔尺寸.Plug hole size | 0.5mm | |
| 9.前處理Pre-treatment | 水洗刷磨、烘烤Wash water mill, baking | |
| 文字 Silk Screen |
1.最小文字尺寸(最小文字符號)Minimum text size (smallest text symbol) | 5mil(線寬Line Width)28mm(高High ) |
| 2.文字與錫墊的間距The distance between text and tin pad | 5mil | |
| 碳墨 Carbon ink |
1.最小到最大板厚Minimum to the maximum thickness | 無No |
| 2.板面尺寸Board Size | 400x500mm | |
| 3.碳墨厚度The thickness of the carbon ink | 0.8~2 mils在銅面上(On copper surface) | |
| 5.碳墨錫墊(應比電路錫墊大)Tin-carbon ink pad (pad should be larger than the circuit tin) | 8mil | |
| 6.碳墨錫墊間距Tin-carbon ink pad pitch | 31mil | |
| 7.可印碳墨間距Spacing can be printed carbon ink | 15mil | |
| 噴錫 HAL |
1.最小到最大板厚Minimum to the maximum thickness | 0.6~5.0mm |
| 2.板面尺寸最小到最大The smallest to the largest board size | 160~595mm | |
| 3.最小孔徑(無錫塞)The smallest aperture (Wuxi plug) | 0.45mm | |
| 4.錫厚最小到最大The smallest to the largest tin thickness | 30~1000 | |
| 金手指 Goldfinger |
1.最小到最大板厚Minimum to the maximum thickness | 0.5~4.0mm |
| 2.板面尺寸最小到最大(工作板面尺寸極限) The smallest to the largest board (board size limits work) |
150~610mm | |
| 3.鎳厚度最小到最大Minimum to the maximum thickness of nickel | 80~200mm | |
| 4.金厚度最小到最大Gold thickness of the smallest to the largest | 3u"~60u" | |
| 成型 Routing |
1.最小到最大板厚Minimum to the maximum thickness | 0.2~6.0 |
| 2.成品板尺寸Finished board size | 5x5mm | |
| 3.外型尺寸公差Dimension Tolerance | +/-0.1mm | |
| 4.成型最好公差Best Tolerance Molding | 0.15mm | |
| 5.金手指間U槽公差Tolerance between the U-slot cheat | +/-0.05mm | |
| V形切割 V Score |
1.最小到最大板厚Minimum to the maximum thickness | 0.3~5.0mm |
| 2.板面尺寸長X寬Board Size Length X Width | 最小Least 90x55mm 最大Maximum(寬Wide)550mmx(高High)不限Limited | |
| 3.位置準確性及殘留公差Location accuracy and the residual tolerance | +/-0.05mm | |
| 4.V形切割角度V-cut angle | 30度 Degree 45度Degree | |
| 5.V形切割跳刀V-shaped cutting knife dance | 最小間距Minimum spacing3mm (30度 Degree) | |
| 金手指斜邊 Hypotenuse cheat |
1.金手指斜邊角度Finger hypotenuse angle | 20/30/45度 |
| 2.最小到最大板厚Minimum to the maximum thickness | 0.8mm | |
| 3.最小到最大成品尺寸Finished size of the smallest to the largest | 0.25~1.81mm | |
| 抗氧化 ENTEK |
1.最小到最大板厚Minimum to the maximum thickness | 0.1~5.0mm |
| 2.最小到最大單片尺寸Size of the smallest to the largest single | 80~640mm | |
| 3.覆蓋厚度Cover thickness | 0.2~0.4mm | |
| 目視檢查 Visual inspection |
1.彎翹Bending upwards | 仟分之7 7 parts per thousand |
| 2.離子污染Ion contamination | 區域塊分隔Regional blocks are separated | |
| 3.烘板Baking sheet | 15分鐘 140度 140 degrees 15 minutes | |
| 測試 Test |
1.輸入格式Input format | IPC356 |
| 2.測試章Chapter Test | YES | |
| 3.斷短路測試點間距Short-circuit breaking test point spacing | 4/4mil | |
| 4.斷短路測試板子尺寸Short-circuit breaking test board size | 610X620mm | |
| 5.斷短路測試點數量.Short-circuit breaking number of test points | 無限制Unlimited | |
| 6.斷短路測試條件(電壓/開路阻抗)Short-circuit breaking test conditions (voltage / open circuit impedance) |
DC 5/10 V 10Ω~20Ω±2Ω | |
| 7.阻抗 Impedance | 絕緣阻抗Insulation Resistance ±10% | |
| 表面處理 Surface treatment |
噴錫HAL 抗氧化ENTEK 全板金Gold plating 化鎳金Electroless Nickel / Immersion Gold 化銀Immersion silver |
30/1500 u" 0.15/0.35um 10-20u" 100-200u"Ni 1-2" Au 6/15u" |